Precision multi-axis electronic additive manufacturing equipment and control systems
Microfluidic printhead structural design and arrayed direct-write printing technology
Functional electronic additive materials suitable for mass production
Meets mass production demands, scalable to hundreds of concurrent print heads
Enables 3D composite processing of metals, dielectrics, and other functional materials
Achieves self-supporting complex 3D structures
Adaptable to surface printing with complex 3D topological structures
Enables end-to-end workflow and full-line setup including laser processes, diverse printing methods, and inspection
Photonic sintering, in-situ sintering, etc.
Ultrahigh Resolution Additive Manufacturing Solutions For Electronics
Micro/nano Direct Ink Writing（DIW）technology can achieve 1 μ m ultra precision circuit printing, and directly construct circuit patterns by extruding conductive nanoparticle ink through fine nozzles.
Our self-developed material system's unique fluid dynamics enables precise direct ink writing of complex 3D structures. Simple heating or photocuring yields stable structures—an efficient,convenient solution.
By using multi axis motion control and compensation algorithms, high-precision circuit processing of complex surfaces can be achieved, adapting to various shapes of substrates.
Our self-developed material system enables precise, complex 3D structures via Direct Ink Writing (DIW). Rapid solidification with simple heating or UV curing provides an efficient, convenient 3D manufacturing solution.
Our self-developed embedded direct-write 3D printing system uses support material assistance to precisely build complex metal and non-metal 3D structures. Optimized thermal curing and support removal enable 1–10 µm features for high-precision micro-nano manufacturing.
Self-developed system combining direct ink writing & precision coating enables high-precision multilayer circuits. With drilling, laser punching, and printed via filling for interconnection — a one-stop HDI solution.
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