Composed of nano/micron particles, enabling high-performance sintering at ≤200 °C. Suitable for direct writing printing with line widths ≤50 μm in various scenarios; certain formulations achieve printing resolutions of 1–10 μm. Features high electrical conductivity and high thermal conductivity. Customized product development is supported.
Composed of nano/micro particles, achieving high-performance sintering at 200 °C–300 °C. Suitable for direct writing printing with line widths ≤50 μm in various scenarios; certain formulations enable printing down to ≤20 μm. Supports customized product development.
Includes dam glue, encapsulant, underfill, optical UV adhesive, and more. Exhibits excellent adhesion to most substrates such as PET film, ceramics, glass, PI, and PCB boards. Applicable in displays, electronic components, module assemblies, printed circuit boards, and other fields. Supports customized product development.
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